Product details table:

Physical and chemical properties:

Physical properties

Appearance:

It usually presents a reddish-brown metallic color, with a smooth surface and high gloss. Different surface effects can be obtained through different surface treatment processes, such as mirror polishing, brushing, etc. Copper plates are often used in applications where their aesthetic appeal and excellent conductivity are highly valued.

Density:

The density is relatively high, generally around 8.96g/cm³. For example, the density of pure copper plates is about 8.96g/cm³, which is significantly higher than that of stainless steel or aluminum.

Melting point:

The melting point is relatively high, generally around 1083℃. This makes copper plates suitable for use in high-temperature environments while maintaining stability.

Coefficient of thermal expansion:

The coefficient of thermal expansion is moderate. In the range of room temperature to 100℃, the coefficient of thermal expansion of copper is about 16.5×10⁻⁶/℃. This feature enables it to maintain dimensional stability in environments with significant temperature changes.

Thermal conductivity:

The thermal conductivity is excellent, with a thermal conductivity coefficient of about 385W/(m・K), which is much higher than that of stainless steel and most other metals. This makes copper plates ideal for heat transfer applications.

Electrical conductivity:

Copper plates have excellent electrical conductivity, with a conductivity of about 5.96×10⁷ S/m, which is among the highest of all metals. This property makes them indispensable in electrical and electronic applications.

Chemical properties

Corrosion resistance:

Copper plates exhibit good corrosion resistance due to the formation of a protective oxide layer on their surface. This oxide layer prevents further oxidation and corrosion in atmospheric and water environments. However, in acidic or ammoniacal environments, copper may corrode more easily.

Antioxidation:

Copper has moderate oxidation resistance at room temperature, forming a stable oxide layer (cuprous oxide or cupric oxide) over time. At high temperatures, copper oxidizes more readily, so it is often alloyed with other metals to improve its oxidation resistance.

Chemical stability:

In general chemical media, copper plates show good chemical stability but may react with strong acids (such as nitric acid or sulfuric acid) or alkalis. In specific environments, such as exposure to ammonia or sulfur compounds, copper’s corrosion resistance may be compromised.

Passivation:

Although copper does not naturally form a passivation film like stainless steel, it develops a protective patina over time when exposed to air. This patina enhances its resistance to corrosion and environmental degradation. Artificial passivation treatments, such as applying protective coatings, can further improve its durability.

Application:

Copper plates are widely used in many fields due to their excellent electrical and thermal conductivity, corrosion resistance, and aesthetic appeal. In the electrical and electronics industries, they are used to manufacture busbars, circuit boards, and connectors, ensuring efficient energy transfer. In architecture, copper plates are used for roofing, cladding, and decorative elements due to their durability and attractive appearance. In mechanical engineering, they are used for heat exchangers, gaskets, and bearings. In the food processing industry, copper plates are used for specific equipment requiring hygienic and antimicrobial properties. Additionally, in fields such as chemical equipment, art sculptures, and marine applications, copper plates are indispensable due to their ability to adapt to various working environments.